specification for approval document : srqg0000nh revision : a0 page : 1 of 7 1/32w, 01005 low resistance chip resistor (lead / h alogen free) 1. scope this specification applies 0.2mm x 0.4mm (01005) si ze 1/32w, fixed metal film chip resistors rectangular type for use in electronic equipment. 2. type designation rl 0204 g (1) (2) (3) (4) where (1) series no. (2) power rating g = 1/32w (3) resistance value: for example r300 = 0.3 w (4) resistance tolerance: f= 1% g= 2% j= 5% 3. construction and physical dimensions figure 1. structure (no mark) code letter dimensions (mm) l 0.40 0.03 w 0.21 0.03 t 0.14 0.03 a 0.10 0.03 b 0.10 0.03 note: resistive element ( under protection film ) electrode protection film (up side:white color; down side:black color) substrate b ? l ? a ? w ? ? a b ? ? ? ? t
specification for approval document : srqg0000nh revision : a0 page : 2 of 7 4. ratings 4-1 specification power rating* 1/32 w resistance range 0.3 w ~ 1.0 w temperature coefficient of resistance 200ppm/ resistance tolerance 1% , 2% , 5% note*: power rating is based on continuous full load opera tion at rated ambient temperature of 70 . for resistors operated at ambient temperature in ex cess of 70 , the maximum load shall be derated in accordance with the following curve. figure 2 derating curve 4-2 rated voltage the rated voltage shall be determined by the follow ing expression. r p v = where v rated voltage (v) r nominal resistance value ( w ) p rated dissipation (w) 4-3 operating and storage temperature range -55 to +125 -55 0 70 125 100 50 % percentage of the rated dissipation ambient temperature
specification for approval document : srqg0000nh revision : a0 page : 3 of 7 5. characteristics test item condition of test requirements short time overload 2.5 * rated power for 5 seconds refer to jis c 5201-1 4.13 d r : (2.0%+0.0005 w ) without significant damage by flashover ( spark, arching ), burning or breakdown etc. insulation resistance the resistor shall be cramped in the metal block and tested , as shown below. test voltage : 100 15v dc for 1 minute refer to jis c 5201-1 4.6 mounting condition g. between electrode and protection film 100m w or over between electrode and substrate 1,000m w or over voltage proof the voltage : 100v ac (rms.) for 1 minute refer to jis c 5201-1 4.7 d r : (2.0%+0.0005 w ) without damage by flashover, fire or breakdown, as shown below. thermal shock -55 ~125 5 cycles, 15 min at each extreme condition refer to jis c 5201-1 4.19 d r : (1.0%+0.0005 w ) without distinct damage in appearance low temperature storage kept at -55 , 1,000 hours refer to jis c 5201-1 4.23.4 d r : (5.0%+0.0005 w ) without distinct damage in appearance high temperature exposure kept at 125 for 1,000 hours refer to jis c 5201-1 4.23.2 d r : (5.0%+0.0005 w ) without distinct damage in appearance solderability temperature of solder : 245 5 immersion duration : 2 0.5 second refer to jis c 5201-1 4.17 uniform coating of solder cover minimum of 95% surface being immersed resistance to soldering heat dipped into solder at 270 5 for 10 1 seconds refer to jis c 5201-1 4.18 d r : (1.0%+0.0005 w ) without distinct deformation in appearance
specification for approval document : srqg0000nh revision : a0 page : 4 of 7 test item condition of test requirements load life rated voltage for 1.5 hours followed by a pause 0.5 hour at 70 2 . cycle repeated 1000 hours refer to jis c 5201-1 4.25 d r : (5.0%+0.0005 w ) without distinct damage in appearance damp heat with load 40 2 with relative humidity 90% to 95%. d.c. rated voltage for 1.5 hours on and 30 minutes off. cycle repeated 1,000 hours refer to jis c 5201-1 4.24 d r : (5.0%+0.0005 w ) without distinct damage in appearance mechanical shock 100 gs for 6milliseconds. 5 pulse s refer to jis c 5201-1 4.21 d r : (0.5%+0.0005 w ) without mech anical damage such as break bending test glass-epoxy board thickness : 1.6mm bending width : 2mm between the fulcrums : 90mm refer to jis c 5201-1 4.33 d r : (1.0%+0.0005 w ) without mech anical damage such as break
specification for approval document : srqg0000nh revision : a0 page : 5 of 7 6. recommended solder pad dimensions w l d 0204 0.2~0.4 0.5~0.8 0.17~0.3 unit : mm note : we recommend there is no circuit design bet ween pads to avoid circuit short cu trace w l d sensing trace
specification for approval document : srqg0000nh revision : a0 page : 6 of 7 0.39max. 8.00.2 carrier cavity b=0.450.05 a=0.250.05 unit : mm pull direction 1.750.1 4.00.1 1.5 b a +0.1 -0.0 sprocket hole 2.00.05 3.50.05 0.310.03 0.150.02 7. packaging 7-1 dimensions 7-1-1 tape packaging dimensions 7-1-2 reel dimensions 2.00.5 9.0 0.3 11.4 1.0 unit : mm 178 2.0 60 2.0 21 0.8 13 0.2 0.170.02
specification for approval document : srqg0000nh revision : a0 page : 7 of 7 7-2 peel force of top cover tape the peel speed shall be about 300 mm/min. the peel force of top cover tape shall be between 0 .1 to 0.5 n. 7-3 numbers of taping 20,000 pieces /reel 7-4 making the following items shall be marked on the reel. (1) type designation. (2) quantity (3) manufacturing date code (4) manufacturers name 165 ~ 180 top cover tape 0.1~0.7 n
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